Letv Le Max Pro Smartphone goes official; First to Pack Snapdragon 820 and Sense ID

Letv Le Max Pro Smartphone goes official; First to Pack Snapdragon 820 and Sense ID

Finally Letv Le max Pro with Snapdragon 820 processor is made official at ces 2016, making it the first device to pack the chipset. The company announced the device at CES 2016 and revealed more details on its specifications as well as new exclusive images.

The Letv Le max Pro is not only first to pack Snapdragon 820 chipset but also first to sport Qualcomm’s Snapdragon Sense ID- an ultrasonic-based fingerprint biometric authentication technology. The company claims the technology is more reliable and secure than the current capacitive-based fingerprint technologies found many flagships out there. However, at least some people are concerned about privacy violation such technology poses as the scanned fingerprints being uploaded and stored on remote server, especially in a time of NSA surveillance.

Moving on, the device also boasts of superfast LTE support and super-fast multi-band WiFi 802.11ad wireless connectivity. The device sports 5.5-inch Quad HD (1440 x 2440 pixels) display and will come with Android 6.0 Marshmallow right out of the box.

The device packs 4GB of RAm, up to 128GB of storage, a 21MP rear camera with optical image stabilization, and a 3,400 mAh battery

The company seems to be determined to give mainstream smartphones a run for their money. The device not only packs all the high-end things under the hood but also some exceptional features.

The device also supports Qualcomm Quick Charge 2.0, that means  the users will be able to charge the device from 0% to 60% in just 30 minutes.

Other details like pricing and availability of the device is yet to be revealed. Currently the company is only selling the accessories in the US.

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